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BYV32EX-300P Tech Specifications

WeEn Semiconductors  BYV32EX-300P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Contact plating gold-plated
Number of pins 19pins
Diode Element Material SILICON
Number of Terminals 3Terminals
Exterior Housing Material 2
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WEEN SEMICONDUCTORS CO LTD
Date Of Intro 2019-04-02
Forward Voltage-Max (VF) 1.25 V
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x19
Gross weight 0.72 g
Operating temperature -40...163°C
JESD-609 Code e3
ECCN Code EAR99
Terminal Finish TIN
Terminal Position SINGLE
Terminal Form THROUGH-HOLE
Reach Compliance Code unknown
Current rating 1.5A
Reference Standard IEC-60134
JESD-30 Code R-PSFM-T3
Configuration COMMON CATHODE, 2 ELEMENTS
Diode Type RECTIFIER DIODE
Case Connection ISOLATED
Output Current-Max 10 A
Number of Phases 1Phase
Rep Pk Reverse Voltage-Max 300 V
JEDEC-95 Code TO-220AB
Non-rep Pk Forward Current-Max 242 A
Reverse Current-Max 20 μA
Rated voltage 60V
Reverse Recovery Time-Max 0.035 μs
Reverse Test Voltage 300 V
2nd Connector Number of Positions Loaded ULTRA FAST SOFT RECOVERY POWER
Profile beryllium copper
Plating thickness 0.254µm
Flammability rating UL94V-0
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