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BYV25G-600 Tech Specifications
WeEn Semiconductors BYV25G-600 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Diode Element Material | SILICON | |
| Number of Terminals | 3Terminals | |
| Exterior Housing Material | 1 | |
| Package Style | IN-LINE | |
| Package Shape | RECTANGULAR | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Description | TO-262, I2PAK-3 | |
| Ihs Manufacturer | WEEN SEMICONDUCTORS CO LTD | |
| Part Life Cycle Code | Active | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Terminal Position | SINGLE | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reach Compliance Code | unknown | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PSIP-T3 | |
| Qualification Status | Not Qualified | |
| Configuration | SINGLE | |
| Diode Type | RECTIFIER DIODE | |
| Output Current-Max | 5 A | |
| Number of Phases | 1Phase | |
| Rep Pk Reverse Voltage-Max | 600 V | |
| JEDEC-95 Code | TO-262AA | |
| Non-rep Pk Forward Current-Max | 66 A | |
| Reverse Recovery Time-Max | 0.06 μs | |
| 2nd Connector Number of Positions Loaded | ULTRA FAST SOFT RECOVERY |
BYV25G-600 Documents
Download datasheets and manufacturer documentation for BYV25G-600
- Datasheets61cf2a10c3bf0df9b1b8103c0c54c52c.pdf
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