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BYC30-600P Tech Specifications

WeEn Semiconductors  BYC30-600P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Material polyolefin
Diode Element Material SILICON
Number of Terminals 2Terminals
Exterior Housing Material 1
Part Life Cycle Code Active
Ihs Manufacturer WEEN SEMICONDUCTORS CO LTD
Package Description SOD-59, 3/2 PIN
Forward Voltage-Max (VF) 2.75 V
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Gross weight 86.10
Transport packaging size/quantity 103*26*26/100
Diameter before shrinkage 25 mm
Diameter after shrinkage 8 mm
Nominal diameter 25 mm
Wall thickness before shrinkage 0.8 mm
Shrinkage temperature 100 degrees C
Packaging supplied in packs in multiples of 1.0 m
ECCN Code EAR99
Type Heat shrink tube with adhesive layer
Color green
Additional Feature LOW LEAKAGE CURRENT
HTS Code 8541.10.00.80
Terminal Position SINGLE
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reference Standard IEC-60134
JESD-30 Code R-PSFM-T2
Configuration SINGLE
Diode Type RECTIFIER DIODE
Case Connection CATHODE
Output Current-Max 30 A
Number of Phases 1Phase
Operating temperature range -55…+125 degrees C
Rep Pk Reverse Voltage-Max 600 V
JEDEC-95 Code TO-220AC
Non-rep Pk Forward Current-Max 220 A
Reverse Current-Max 10 μA
Breakdown Voltage-Min 600 V
Reverse Recovery Time-Max 0.035 μs
Reverse Test Voltage 600 V
2nd Connector Number of Positions Loaded HYPER FAST RECOVERY POWER
Operating voltage <1500 V
Shrink ratio 3 : 1
Length 1000 mm
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BYC30-600P Documents

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