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BYC15-600P Tech Specifications

WeEn Semiconductors  BYC15-600P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Housing material nickel-plated brass
Diode Element Material SILICON
Number of Terminals 2Terminals
Exterior Housing Material 1
Part Life Cycle Code Active
Ihs Manufacturer WEEN SEMICONDUCTORS CO LTD
Forward Voltage-Max (VF) 3.2 V
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Gross weight 74.80
Transport packaging size/quantity 62*27*28/50
Switching scheme ON-OFF + OFF-ON with fixation
Protection class IP65
Number of switching cycles (electric) 50000switching cycles (electric)s
Relative humidity 45...85 %
Nominal voltage 250 V
Dielectric strength 2000 (50 Hz / 5 s) V
Button and head shape flat ring and button
Mounting diameter 30 mm
ECCN Code EAR99
Additional Feature LOW LEAKAGE CURRENT
Terminal Position SINGLE
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reference Standard IEC-60134
JESD-30 Code R-PSFM-T2
Contact resistance 50 mΩ max
Configuration SINGLE
Insulation resistance 1000 MΩ min
Diode Type RECTIFIER DIODE
Case Connection CATHODE
Switch type GQ30 series non-illuminated vandal-proof button
Number of Phases 1Phase
Operating temperature range -25…+55 °C
Rated current 5 A
Rep Pk Reverse Voltage-Max 600 V
JEDEC-95 Code TO-220AC
Non-rep Pk Forward Current-Max 200 A
Reverse Current-Max 10 μA
Reverse Recovery Time-Max 0.018 μs
2nd Connector Number of Positions Loaded HYPER FAST RECOVERY POWER
Contacts 4Pin
Diameter 35 mm
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BYC15-600P Documents

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