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IHLP2525BDER8R2M01 Tech Specifications

Dale  IHLP2525BDER8R2M01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Nonstandard
Terminal Shape J BEND
Number of Pins 2Pins
Shape/Size Description RECTANGULAR PACKAGE
Core Material Composite, Ferrite, Metal
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series IHLP-2525BD-01
Published 2009
Size / Dimension 0.270Lx0.255W 6.86mmx6.47mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Termination SMD/SMT
ECCN Code EAR99
Type Molded
Resistance 84.2mOhm
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
HTS Code 8504.50.80.00
Packing Method TR, 13 Inch
Shielding YES
Number of Functions 1Function
Depth 6.72mm
Construction Rectangular
Current Rating 3A
Military Standard Not
Inductance 8.2μH
Test Frequency 100kHz
DC Resistance (DCR) 106mOhm Max
Max DC Current 8A
Inductor Application HIGH CURRENT INDUCTOR
Terminal Placement DUAL ENDED
Inductance Tolerance 20%
RMS Current (Irms) 3A
Self Resonant Frequency 5MHz
Height 2.4mm
Height Seated (Max) 0.094 2.40mm
REACH SVHC Unknown
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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IHLP2525BDER8R2M01 Documents

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