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1SS226,LF Tech Specifications

Toshiba  1SS226,LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Diode Element Material SILICON
Number of Elements 2 Elements
Power Dissipation (Max) 0.15W
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
JESD-30 Code R-PDSO-G3
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 500nA @ 80V
Voltage - Forward (Vf) (Max) @ If 1.2V @ 100mA
Forward Current 100mA
Operating Temperature - Junction 125°C Max
Output Current-Max 0.1A
Voltage - DC Reverse (Vr) (Max) 80V
Reverse Recovery Time 4 ns
Max Repetitive Reverse Voltage (Vrrm) 85V
Peak Non-Repetitive Surge Current 2A
Diode Configuration 1 Pair Series Connection
Radiation Hardening No
RoHS Status RoHS Compliant
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