TMP47C858F Tech Specifications

Toshiba  TMP47C858F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 100Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code QFP
Package Description QFP, QFP100,.7X.9
Clock Frequency-Max 0.96 MHz
Number of I/O Lines 35I/O Lines
Operating Temperature-Max 60 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
RAM(byte) 256
ROM(word) 8192
Supply Voltage-Max 6 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 100
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
Temperature Grade OTHER
Speed 0.96 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 5 mA
Bit Size 4
Has ADC NO
DMA Channels NO
PWM Channels NO
DAC Channels NO
Seated Height-Max 3.05 mm
On Chip Program ROM Width 8
CPU Family TLCS-470
Boundary Scan NO
ROM Programmability MROM
Length 20 mm
Width 14 mm
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TMP47C858F Documents

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