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THGBMHG9C8LBAB8 Tech Specifications

Toshiba  THGBMHG9C8LBAB8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 153Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Package Description FBGA-153
Date Of Intro 2017-06-23
Number of Words 68719476736 wordsWord
Number of Words Code 64000000000Words Codes
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
ECCN Code EAR99
Additional Feature ALSO ORGANISED AS 512GX1
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B153
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 64GX8
Memory Width 8
Memory Density 549755813888 bit
Screening Level AEC-Q100
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 2.7 V
Alternate Memory Width 4
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THGBMHG9C8LBAB8 Documents

Download datasheets and manufacturer documentation for   THGBMHG9C8LBAB8

  • Datasheets
THGBMHG9C8LBAB8 brand manufacturers: Toshiba America Electronic Components, Twicea stock, THGBMHG9C8LBAB8 reference price.Toshiba America Electronic Components. THGBMHG9C8LBAB8 parameters, THGBMHG9C8LBAB8 Datasheet PDF and pin diagram description download.You can use the THGBMHG9C8LBAB8 Memory - Modules, DSP Datesheet PDF, find THGBMHG9C8LBAB8 pin diagram and circuit diagram and usage method of function,THGBMHG9C8LBAB8 electronics tutorials.You can download from the Twicea.