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SSM6N7002CFU Tech Specifications

Toshiba  SSM6N7002CFU technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Contact plating gold-plated
Surface Mount YES
Number of pins 4pins
Number of Terminals 6Terminals
Transistor Element Material SILICON
Exterior Housing Material 2
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x4
Gross weight 0.31 g
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Package Description ,
Drain Current-Max (ID) 0.17 A
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Operating temperature -40...163°C
ECCN Code EAR99
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G6
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
Operating Mode ENHANCEMENT MODE
Transistor Application SWITCHING
Polarity/Channel Type N-CHANNEL
Drain-source On Resistance-Max 4.7 Ω
DS Breakdown Voltage-Min 60 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs) 0.285 W
Rated voltage 60V
Feedback Cap-Max (Crss) 0.7 pF
Profile beryllium copper
Plating thickness 0.75µm
Flammability rating UL94V-0
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SSM6N7002CFU Documents

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