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VFS11-6075 Tech Specifications

Toshiba  VFS11-6075 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case Radial, Tubular
Mounting Feature Brackets (not included)
Operating Temperature -55°C ~ 350°C
Series FVT
Packaging Bulk
Size / Dimension 0.563 Dia x 2.000 L (14.30mm x 50.80mm)
Tolerance ±5%
Part Status Active
Temperature Coefficient ±260ppm/°C
Resistance 750 Ohms
Composition Wirewound
Power (Watts) 25W
Failure Rate --
Lead Style Solder Lugs
Coating, Housing Type Vitreous Enamel Coated
Features --
Height Seated (Max) --
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