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VFS11-2022PM-WN Tech Specifications

Toshiba  VFS11-2022PM-WN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Contact Shape --
Voltage, Rating 50V
Mated Stacking Heights 1.65mm
Contact Materials Copper Alloy
Contact Finish Mating Gold
Insulation Materials Plastic
Operating Temperature -40°C ~ 85°C
Series FI-JW
Packaging Bulk
Part Status Obsolete
Termination Solder
Connector Type Receptacle
Number of Positions 50Positions
Applications --
Number of Rows 1Row
Fastening Type Friction Lock
Contact Type Non-Gendered
Ingress Protection --
Insulation Height 0.063 (1.60mm)
Style Board to Cable/Wire
Number of Positions Loaded All
Current Rating 0.25A per Contact
Pitch - Mating 0.012 (0.30mm)
Insulation Color Black
Row Spacing - Mating --
Contact Length - Post --
Contact Finish - Post Gold
Features Grounding Pins, Pick and Place, Solder Retention
Contact Finish Thickness - Mating 3.90µin (0.099µm)
Contact Finish Thickness - Post Flash
Material Flammability Rating UL94 V-0
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