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TLP5752(D4-TP4,E Tech Specifications

Toshiba  TLP5752(D4-TP4,E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case SOIC-6
Mounting Type Surface Mount
Supplier Device Package 6-SO
Unit Weight 0.004445 oz
Fall Time 8 ns
If - Forward Current 10 mA
Maximum Operating Temperature + 110 C
Minimum Operating Temperature - 40 C
Mounting Styles SMD/SMT
Pd - Power Dissipation 40 mW
Propagation Delay - Max 150 ns
Factory Pack QuantityFactory Pack Quantity 1500
Peak Forward Voltage 1.7 V
Supplier Package SOIC
Number of Channels per Chip 1
Output Device MOSFET
Maximum Rise Time 15 ns
Maximum Fall Time 8 ns
Minimum Isolation Voltage 5000 Vrms
Mounting Surface Mount
Vr - Reverse Voltage 5 V
Package Tape & Reel (TR)
Base Product Number TLP5752
Mfr Toshiba Semiconductor and Storage
Product Status Active
Packaging Reel
Series TLP5752
Operating Temperature -40 to 110 °C
Type Photocoupler
Technology Optical Coupling
Pin Count 6
Approval Agency CQC, CSA, cUL, UL, VDE
Voltage - Isolation 5000Vrms
Output Type DC
Number of Channels 1 ChannelChannel
Voltage - Forward (Vf) (Typ) 1.55V
Input Type DC
Current - Output High, Low 2.5A, 2.5A
Rise Time 15 ns
Rise / Fall Time (Typ) 15ns, 8ns
Reverse Voltage 5 V
Screening Level Extended Industrial
Current - DC Forward (If) (Max) 20 mA
Input Current 20 mA
Propagation Delay tpLH / tpHL (Max) 150ns, 150ns
Common Mode Transient Immunity (Min) 35kV/µs
Isolation Voltage 5000 Vrms
Pulse Width Distortion (Max) 50ns
Voltage - Output Supply 15V ~ 30V
Current - Peak Output 2.5A
Vf - Forward Voltage 1.55 V
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