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TC74HC02AF(F) Tech Specifications

Toshiba  TC74HC02AF(F) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Number of Pins 14Pins
ECCN (US) EAR99
Logic Family HC
Number of Elements per Chip 4Elements per Chips
Number of Element Inputs 2-INElement Input
Number of Output Enables per Element 0
Number of Selection Inputs per Element 0
Number of Element Outputs 1Element Output
Maximum Propagation Delay Time @ Maximum CL (ns) 13@6V|15@4.5V|75@2V
Absolute Propagation Delay Time (ns) 95
Process Technology CMOS
Maximum Low Level Output Current (mA) 5.2
Maximum High Level Output Current (mA) -5.2
Minimum Operating Supply Voltage (V) 2
Typical Operating Supply Voltage (V) 5|3.3|2.5
Maximum Operating Supply Voltage (V) 6
Maximum Quiescent Current (uA) 1
Propagation Delay Test Condition (pF) 50
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Standard Package Name SOP
Supplier Package SOP
Mounting Surface Mount
Package Height 1.5
Package Length 10.8(Max)
Package Width 5.3
PCB changed 14
Lead Shape Gull-wing
Number of Elements 4 Elements
RoHS Compliant
Dimensions 10.3 x 5.3 x 1.5mm
Minimum Operating Supply Voltage 2 V
Package Type SOP
Maximum Operating Temperature +85 °C
Maximum Propagation Delay Time @ Maximum CL 13 ns @ 6 V, 15 ns @ 4.5 V, 75 ns @ 2 V
Minimum Operating Temperature -40 °C
Maximum Operating Supply Voltage 6 V
Packaging Tube
Part Status Active
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
Pin Count 14
Max Supply Voltage 6 V
Min Supply Voltage 2 V
Propagation Delay 13 ns
Logic Function NOR
High Level Output Current -5.2 mA
Low Level Output Current 5.2 mA
Schmitt Trigger Input No
Width 5.3 mm
Height 1.5 mm
Length 10.3 mm
RoHS Status RoHS Compliant
Radiation Hardening No
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TC74HC02AF(F) Documents

Download datasheets and manufacturer documentation for   TC74HC02AF(F)

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