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TC74AC373P Tech Specifications

Toshiba  TC74AC373P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lead Shape Through Hole
PCB changed 20
Package Width 6.4
Package Length 25.1(Max)
Package Height 3.5
Mounting Through Hole
Supplier Package PDIP
Standard Package Name DIP
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) -40
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (uA) 8
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 5|2.5|3.3
Minimum Operating Supply Voltage (V) 2
Maximum High Level Output Current (mA) -24
Maximum Low Level Output Current (mA) 24
Process Technology CMOS
Absolute Propagation Delay Time (ns) 15
Maximum Propagation Delay Time @ Maximum CL (ns) 8.3@5V|12.9@3.3V
Set/Reset No
Bus Hold No
Number of Output Enables per Element 1
Number of Outputs per Chip 8Outputs per Chips
Number of Selection Inputs per Element 0
Number of Input Enables per Element 1
Number of Inputs per Chip 8Inputs per Chips
Number of Elements per Chip 1
Number of Channels per Chip 8Channels per Chips
Latch Mode Transparent
Logic Family AC
HTS 8542.39.00.01
ECCN (US) EAR99
Packaging Tube
Part Status Obsolete
Type D-Type
Pin Count 20
Output Type 3-State
Polarity Non-Inverting
RoHS Status RoHS non-compliant
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TC74AC373P Documents

Download datasheets and manufacturer documentation for   TC74AC373P

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