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TPS22908YZTR Tech Specifications
Texas Instruments TPS22908YZTR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) | |
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 4-UFBGA, DSBGA | |
| Number of Pins | 4Pins | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Digi-Reel® | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 4Terminations | |
| ECCN Code | EAR99 | |
| Resistance | 32.1Ohm | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Supply Voltage | 1.2V | |
| Terminal Pitch | 0.5mm | |
| Base Part Number | TPS22908 | |
| Number of Outputs | 1Output | |
| Output Type | P-Channel | |
| Supply Voltage-Min (Vsup) | 1V | |
| Number of Channels | 1Channel | |
| Interface | On/Off | |
| Analog IC - Other Type | SPST | |
| Output Configuration | High Side | |
| Output Current | 1A | |
| Voltage - Supply (Vcc/Vdd) | Not Required | |
| Quiescent Current | 190nA | |
| Input Type | Non-Inverting | |
| Switch Type | General Purpose | |
| Nominal Input Voltage | 3.6V | |
| Ratio - Input:Output | 1:1 | |
| Voltage - Load | 1V~3.6V | |
| Switching | BREAK-BEFORE-MAKE | |
| Rds On (Typ) | 28.2m Ω | |
| Switch-off Time-Max | 7000ns | |
| Features | Load Discharge, Slew Rate Controlled | |
| Height | 625μm | |
| Length | 1.25mm | |
| Width | 1.25mm | |
| Thickness | 480μm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
TPS22908YZTR Documents
Download datasheets and manufacturer documentation for TPS22908YZTR
- PCN Design/SpecificationDSBGA/Usip 14/Sep/2016 DSBGA/uSIP 22/Jun/2016
- PCN PackagingCarrier Tape 28/Aug/2018
- PCN Assembly/OriginWCSP Package JCAP 15/Jul/2013
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