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Texas Instruments TBP38S030-25N Memory Modules
TBP38S030-25N
2502-630-TBP38S030-25N
RoHS Compliant
IC,PROM,32X8,TTL,DIP,16PIN,PLASTIC
In Stock Min. : 1
Mult. : 1
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TBP38S030-25N Tech Specifications
Texas Instruments TBP38S030-25N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 16Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | DIP, DIP16,.3 | |
| Access Time-Max | 25 ns | |
| Number of Words | 32 wordsWord | |
| Number of Words Code | 32Words Codes | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PDIP-T16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Supply Current-Max | 0.125 mA | |
| Organization | 32X8 | |
| Memory Width | 8 | |
| Memory IC Type | OTP ROM |
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