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OMAPL137DZKBA3 Tech Specifications

Texas Instruments  OMAPL137DZKBA3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 6 days ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 256-BGA
Number of Pins 256Pins
Memory Types Cache
Number of I/Os 128I/Os
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series OMAP-L1x
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Frequency 375MHz
Base Part Number OMAPL137
Interface SPI, USB
Max Supply Voltage 3.45V
Min Supply Voltage 900mV
Memory Size 32kB
RAM Size 128kB
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor ARM926EJ-S
Data Bus Width 32b
Number of Timers/Counters 2Timers/Counters
Core Architecture ARM
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
Max Junction Temperature (Tj) 105°C
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Number of Cores 1Core
Number of PWM Channels 3PWM Channels
Barrel Shifter NO
Internal Bus Architecture SINGLE
Ambient Temperature Range High 85°C
Display & Interface Controllers LCD
Height 2.05mm
Length 17mm
Width 17mm
Thickness 1.36mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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OMAPL137DZKBA3 Documents

Download datasheets and manufacturer documentation for   OMAPL137DZKBA3

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