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OMAP3530ECUSA Tech Specifications

Texas Instruments  OMAP3530ECUSA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 423-LFBGA, FCBGA
Mount Surface Mount
Number of Pins 423Pins
Memory Types L2 Cache, ROM, SRAM
Series OMAP-35xx
Packaging Tray
Operating Temperature -40°C~105°C TJ
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 423Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.65mm
Frequency 600MHz
Base Part Number OMAP3530
Pin Count 423
Voltage 1.35V
Interface I2C, SPI, UART, USB
Max Supply Voltage 1.35V
Min Supply Voltage 985mV
Memory Size 112kB
RAM Size 64kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A8
Data Bus Width 32b
Core Architecture ARM
Voltage - I/O 1.8V 3.0V
Number of UART Channels 3UART Channels
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR
USB USB 1.x (3), USB 2.0 (1)
Additional Interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Signal Processing; C64x+, Multimedia; NEON™ SIMD
Number of Cores 1Core
Display & Interface Controllers LCD
Height 1.4mm
Length 16mm
Width 16mm
Thickness 960μm
RoHS Status ROHS3 Compliant
Radiation Hardening No
Lead Free Lead Free
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OMAP3530ECUSA Documents

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