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CC3200R1M2RGC Tech Specifications

Texas Instruments  CC3200R1M2RGC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Factory Lead Time 6 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case 64-VFQFN Exposed Pad
Surface Mount YES
Number of Pins 64Pins
Weight 227.391525mg
Memory Types FLASH
Number of I/Os 27I/Os
Operating Temperature -40°C~85°C
Packaging Tray
Series SimpleLink™
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
Type TxRx + MCU
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Voltage - Supply 2.1V~3.6V
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Frequency 2.4GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number CC3200
Operating Supply Voltage 3.6V
Interface I2C, MMC, Parallel, SD, SPI, UART
Memory Size 256kB RAM 64kB ROM
Speed 80 MHz
RAM Size 256kB
Peripherals I2C
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 8b
PWM Channels YES
Number of Timers/Counters 5Timers/Counters
Protocol 802.11b/g/n
Core Architecture ARM
Power - Output 18.3dBm
RF Family/Standard WiFi
Number of UART Channels 2UART Channels
Data Rate (Max) 54Mbps
Number of ADC Channels 4ADC Channels
Serial Interfaces I2C, I2S, JTAG, SPI, UART
Current - Receiving 53mA~59mA
Current - Transmitting 53mA~59mA
Modulation DSSS, OFDM
Sensitivity (dBm) -95.7 dBm
Height 1mm
Length 9mm
Width 9mm
Thickness 880μm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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CC3200R1M2RGC Documents

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