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AM3354BZCE60 Tech Specifications

Texas Instruments  AM3354BZCE60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Package / Case 298-LFBGA
Contact Plating Copper, Silver, Tin
Surface Mount YES
Number of Pins 298Pins
Memory Types ROM
Operating Temperature 0°C~90°C TJ
Packaging Tray
Series Sitara™
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 298Terminations
ECCN Code 5A992.C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Frequency 600MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number AM3354
Pin Count 298
Qualification Status Not Qualified
Operating Supply Voltage 1.1V
Voltage 1.144V
Interface CAN, Ethernet, I2C, SPI, UART, USB
Memory Size 64kB
RAM Size 64kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A8
Bit Size 32
Data Bus Width 32b
Number of Timers/Counters 10Timers/Counters
Core Architecture ARM
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Number of UART Channels 6UART Channels
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2, DDR3, DDR3L
USB USB 2.0 + PHY (2)
Additional Interfaces CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Number of Cores 1Core
Security Features Cryptography, Random Number Generator
Display & Interface Controllers LCD, Touchscreen
Height 1.3mm
Length 13mm
Width 13mm
Thickness 890μm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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AM3354BZCE60 Documents

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