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- ADS58C23IPFP
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ADS58C23IPFP Tech Specifications
Texas Instruments ADS58C23IPFP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) | |
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Package / Case | 80-TQFP Exposed Pad | |
| Number of Pins | 80Pins | |
| Packaging | Tray | |
| JESD-609 Code | e4 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 80Terminations | |
| ECCN Code | 5A991.B.1 | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5mm | |
| Depth | 12.2mm | |
| Frequency | 125MHz | |
| Base Part Number | ADS58C23 | |
| Temperature Grade | INDUSTRIAL | |
| Interface | LVDS, Parallel | |
| Max Supply Voltage | 3.45V | |
| Min Supply Voltage | 3.15V | |
| Number of Inputs | 2Inputs | |
| Power Consumption | 1.63W | |
| Telecom IC Type | TELECOM CIRCUIT | |
| RF Type | Cellular, 3G, LTE, TD-SCDMA | |
| Height | 1.2mm | |
| Length | 12mm | |
| Width | 12mm | |
| Thickness | 1mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
ADS58C23IPFP Documents
Download datasheets and manufacturer documentation for ADS58C23IPFP
- PCN Design/SpecificationCopper Wire Base Alternative 23/Apr/2014
- PCN Assembly/OriginQualification Mold Compound 30/Sep/2014
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