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BZW03C39 Tech Specifications
TEMIC BZW03C39 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Diode Element Material | SILICON | |
| Number of Terminals | 2Terminals | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TEMIC SEMICONDUCTORS | |
| Breakdown Voltage-Nom | 54.1 V | |
| Number of Elements | 1 Element | |
| Operating Temperature-Max | 175 °C | |
| Package Body Material | GLASS | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Power Dissipation (Max) | 1.85 W | |
| Terminal Position | AXIAL | |
| Terminal Form | WIRE | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | O-LALF-W2 | |
| Qualification Status | Not Qualified | |
| Polarity | UNIDIRECTIONAL | |
| Configuration | SINGLE | |
| Diode Type | TRANS VOLTAGE SUPPRESSOR DIODE | |
| Case Connection | ISOLATED | |
| Non-rep Peak Rev Power Dis-Max | 1000 W | |
| Reverse Current-Max | 10 µA |
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