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PC755CMGU400LE Tech Specifications

Teledyne LeCroy  PC755CMGU400LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 360Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Clock Frequency-Max 100 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Pin Count 360
JESD-30 Code S-CBGA-B360
Qualification Status Not Qualified
Temperature Grade MILITARY
Speed 400 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 3.2 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 25 mm
Width 25 mm
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PC755CMGU400LE Documents

Download datasheets and manufacturer documentation for   PC755CMGU400LE

  • Datasheets
PC755CMGU400LE brand manufacturers: Teledyne e2v, Twicea stock, PC755CMGU400LE reference price.Teledyne e2v. PC755CMGU400LE parameters, PC755CMGU400LE Datasheet PDF and pin diagram description download.You can use the PC755CMGU400LE Embedded - Microprocessors, DSP Datesheet PDF, find PC755CMGU400LE pin diagram and circuit diagram and usage method of function,PC755CMGU400LE electronics tutorials.You can download from the Twicea.