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814-AG11D-ESL-LF Tech Specifications

TE Connectivity  814-AG11D-ESL-LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold Over Nickel
Body Orientation Straight
Contact Resistance Max 10(mohm)
Mounting Styles Through Hole
Operating Temp Range -55C to 125C
Rad Hardened No
Pitch (mm) 2.54(mm)
Grid Size Not Required
Contact Materials Beryllium Copper
Termination Method Solder
Product Depth (mm) 10.16(mm)
Row Spacing (mm) 7.62(mm)
Number of Contact Rows 2Contact Rows
Base/Housing Material PCT (Polychlorinated Terphenyl)
Mounting Through Hole
Pitch Spacing 2.54mm
Packaging Box/Tube
Operating Temperature -55 to 125 °C
Connector Type DIP Socket
Type DIP Socket
Number of Rows 2Rows
Gender SKT
Pitch 2.5400 mm
Current Rating 3/Contact(A)
Number of Contacts 14(POS)Contact
Insulation Resistance 5000(Mohm)
Row Spacing 7.62 mm
Insertion Force 1.75N
Product Length 17.78 mm
Product Length (mm) 17.78(mm)
Product Height (mm) 4.57(mm)
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814-AG11D-ESL-LF Documents

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