In Stock Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
2013266-1 Tech Specifications
TE Connectivity 2013266-1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold Over Nickel | |
| Housing Material | Thermoplastic | |
| Body Orientation | Straight | |
| Number of Contact Rows | 2Contact Rows | |
| Product Depth (mm) | 7.54(mm) | |
| Termination Method | Solder | |
| Mounting Styles | Through Hole | |
| Contact Materials | Copper Alloy | |
| Grid Size | Not Required | |
| Rad Hardened | No | |
| Pitch (mm) | 2(mm) | |
| Insulation Materials | Thermoplastic | |
| Packaging | Tray | |
| Type | DDR3 DIMM SOCKET | |
| Gender | SKT | |
| Number of Contacts | 240(POS)Contact | |
| Product Length (mm) | 141(mm) | |
| Product Height (mm) | 23.1(mm) |
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



