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B78477P1002A14 Tech Specifications

TDK  B78477P1002A14 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Housing Material Thermoplastic
Shield Material Copper Alloy
Contact Materials Phosphor Bronze
Operating Temperature -40°C~85°C
Packaging Tray
Series B78477P
Published 2014
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Termination Solder
Connector Type RJ45
Applications 10/100 Base-T, AutoMDIX
Number of Rows 1Row
Orientation 90° Angle (Right)
Shielding Shielded, EMI Finger
Contact Finish Gold
Number of Ports 1Port
LED Color Does Not Contain LED
Tab Direction Down
Number of Cores per Jack 4Cores per Jacks
Features Board Guide
Contact Finish Thickness 15.0μin 0.38μm
Height Above Board 0.541 13.75mm
RoHS Status ROHS3 Compliant
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B78477P1002A14 Documents

Download datasheets and manufacturer documentation for   B78477P1002A14

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