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B57560G1103F005 Tech Specifications
TDK B57560G1103F005 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Mounting Type | Through Hole | |
| Package / Case | Bead, Glass | |
| Surface Mount | NO | |
| Terminal Shape | WIRE | |
| Operating Temperature | -55°C~200°C | |
| Packaging | Bulk | |
| Published | 2014 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Terminal Finish | Tin (Sn) | |
| Additional Feature | GLASS ENCAPSULATED | |
| Resistor Type | NTC THERMISTOR | |
| Rated Power Dissipation (P) | 0.05W | |
| Terminal Placement | RADIAL | |
| Power - Max | 50mW | |
| Resistance Tolerance | ±1% | |
| Thermistor Application | TEMPERATURE SENSING | |
| Resistance in Ω @ 25°C | 10k | |
| B25/85 | 3612K | |
| Thermal Sensitivity Index | 3612 K | |
| B25/100 | 3625K | |
| RoHS Status | ROHS3 Compliant |
B57560G1103F005 Documents
Download datasheets and manufacturer documentation for B57560G1103F005
- Environmental InformationTDK RoHS3
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