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FK18C0G1H3R3C Tech Specifications

TDK  FK18C0G1H3R3C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Dielectric Material CERAMIC
Operating Temperature -55°C~125°C
Packaging Bulk
Series FK
Published 2013
Size / Dimension 0.157Lx0.098W 4.00mmx2.50mm
Tolerance ±0.25pF
JESD-609 Code e3
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Temperature Coefficient C0G NP0
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Applications General Purpose
HTS Code 8532.24.00.60
Capacitance 3.3pF
Voltage - Rated DC 50V
Packing Method AMMO PACK
Lead Pitch 2.4892mm
Capacitor Type CERAMIC CAPACITOR
Lead Spacing 0.098 2.50mm
Temperature Characteristics Code C0G
Multilayer Yes
Lead Diameter 500 μm
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
Height 2.5mm
Height Seated (Max) 0.217 5.50mm
RoHS Status ROHS3 Compliant
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FK18C0G1H3R3C Documents

Download datasheets and manufacturer documentation for   FK18C0G1H3R3C

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