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FK18C0G1H222J Tech Specifications

TDK  FK18C0G1H222J technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Operating Temperature -55°C~125°C
Packaging Bulk
Series FK
Published 2013
Size / Dimension 0.157Lx0.098W 4.00mmx2.50mm
Tolerance ±5%
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Temperature Coefficient C0G NP0
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Applications General Purpose
HTS Code 8532.24.00.60
Capacitance 2200pF
Voltage - Rated DC 50V
Packing Method AMMO PACK
Lead Pitch 2.5mm
Capacitor Type CERAMIC CAPACITOR
Dielectric C0G
Lead Spacing 0.098 2.50mm
Temperature Characteristics Code C0G
Multilayer Yes
Lead Diameter 500 μm
Size Code 1614
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
Height 5.5mm
Height Seated (Max) 0.217 5.50mm
Length 4mm
Width 3.5mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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