TDK EC230X GDT
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Mult. : 1
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EC230X Tech Specifications
TDK EC230X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 2Terminals | |
| Package Description | PACKAGE-2 | |
| Package Style | LONG FORM | |
| Package Body Material | UNSPECIFIED | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 90 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | EC230X | |
| Package Shape | ROUND | |
| Manufacturer | TDK Corporation of America | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TDK CORP | |
| Risk Rank | 5.75 | |
| JESD-609 Code | e3 | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | AXIAL | |
| Terminal Form | WIRE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | O-XALF-W2 | |
| Temperature Grade | INDUSTRIAL | |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
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