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BKP1608HS330-T Tech Specifications

TAIYO YUDEN  BKP1608HS330-T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0603 (1608 Metric)
Number of Pins 2Pins
Core Material Ferrite
Operating Temperature -55°C~85°C
Packaging Tape & Reel (TR)
Series BK
Published 2006
Size / Dimension 0.063Lx0.032W 1.60mmx0.80mm
Tolerance 25%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Resistance 25mOhm
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
HTS Code 8504.50.80.00
Packing Method TAPE AND REEL
Shielding Unshielded
Number of Functions 1Function
Depth 950μm
Construction Multilayer Chip
Current Rating 3A
Case Code (Metric) 1608
Case Code (Imperial) 0603
Test Frequency 100MHz
Impedance 33Ohm
Max DC Current 3A
Halogen Free Halogen Free
Filter Type Power Line
Number of Lines 1Line
DC Resistance (DCR) (Max) 25mOhm
Impedance @ Frequency 33Ohm @ 100MHz
Height 800μm
Width 0.8mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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