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TSM850N06CX RFG Tech Specifications

Taiwan Semiconductor  TSM850N06CX RFG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 25 Weeks
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Current - Continuous Drain (Id) @ 25℃ 3A Tc
Drive Voltage (Max Rds On, Min Rds On) 4.5V 10V
Power Dissipation (Max) 1.7W Tc
Operating Temperature -55°C~150°C TJ
Packaging Digi-Reel®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
FET Type N-Channel
Rds On (Max) @ Id, Vgs 85m Ω @ 2.3A, 10V
Vgs(th) (Max) @ Id 2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 529pF @ 30V
Gate Charge (Qg) (Max) @ Vgs 9.5nC @ 10V
Drain to Source Voltage (Vdss) 60V
Vgs (Max) ±20V
RoHS Status ROHS3 Compliant
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TSM850N06CX RFG Documents

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