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TMJ03DKSD-S1512 Tech Specifications

sullins corp  TMJ03DKSD-S1512 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 3 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-254
Number of Pins 3Pins
Housing Material Polyphenylene Sulfide (PPS)
Number of Positions or Pins (Grid) 3 (Rectangular)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Operating Temperature -50°C~175°C
Packaging Tray
Published 2013
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type Transistor, TO-254
Max Operating Temperature 175°C
Min Operating Temperature -50°C
Current Rating (Amps) 3A
Current Rating 3A
Pitch - Mating 0.150 3.81mm
Contact Finish - Post Gold
Contact Resistance 30mOhm
Pitch - Post 0.150 3.81mm
Features Flange
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
RoHS Status ROHS3 Compliant
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TMJ03DKSD-S1512 Documents

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