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TSV912IDT Tech Specifications

STMicroelectronics  TSV912IDT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 7 months ago)
Factory Lead Time 10 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8Pins
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Packing Method TAPE AND REEL
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2Functions
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number TSV912
Pin Count 8
Output Type Rail-to-Rail
Power Supplies 3/5V
Number of Channels 2Channels
Operating Supply Current 820μA
Nominal Supply Current 780μA
Output Current 35mA
Slew Rate 4.5V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type General Purpose
Common Mode Rejection Ratio 62 dB
Current - Input Bias 1pA
Voltage - Supply, Single/Dual (±) 2.5V~5.5V
Output Current per Channel 35mA
Input Offset Voltage (Vos) 100μV
Unity Gain BW-Nom 8000 kHz
Voltage Gain 91dB
Average Bias Current-Max (IIB) 0.000001μA
Low-Offset NO
Frequency Compensation YES
Supply Voltage Limit-Max 6V
Low-Bias YES
Micropower NO
Bias Current-Max (IIB) @25C 0.00001μA
Programmable Power NO
Power NO
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 125°C
Height 1.75mm
Length 5mm
Width 4mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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TSV912IDT Documents

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