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TMMDB3TG Tech Specifications
STMicroelectronics TMMDB3TG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 8 months ago) | |
| Factory Lead Time | 11 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Package / Case | DO-213AA | |
| Number of Pins | 2Pins | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~125°C TJ | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.30.00.80 | |
| Terminal Position | END | |
| Terminal Form | WRAP AROUND | |
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 2A | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | TMMDB3 | |
| Pin Count | 2 | |
| Max Output Current | 2A | |
| Configuration | SINGLE | |
| Case Connection | ISOLATED | |
| Trigger Device Type | DIAC | |
| Voltage - Breakover | 30V~34V | |
| Current - Breakover | 15μA | |
| Height | 1.62mm | |
| Length | 3.4mm | |
| Width | 1.62mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
TMMDB3TG Documents
Download datasheets and manufacturer documentation for TMMDB3TG
- DatasheetsTMMDB3TG
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