TMMBAT42FILM Tech Specifications

STMicroelectronics  TMMBAT42FILM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 6 months ago)
Factory Lead Time 15 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-213AA (Glass)
Number of Pins 2Pins
Weight 4.535924g
Diode Element Material SILICON
Manufacturer Package Identifier MINIMELF
Number of Elements 1 Element
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Termination SMD/SMT
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -65°C
HTS Code 8541.10.00.70
Capacitance 7pF
Voltage - Rated DC 30V
Max Power Dissipation 200mW
Terminal Position END
Terminal Form WRAP AROUND
Peak Reflow Temperature (Cel) 260
Current Rating 350mA
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number TMMBAT4
Polarity Standard
Element Configuration Single
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 500nA @ 25V
Power Dissipation 200mW
Output Current 200mA
Voltage - Forward (Vf) (Max) @ If 1V @ 200mA
Case Connection ISOLATED
Forward Current 200mA
Max Reverse Leakage Current 500nA
Operating Temperature - Junction -65°C~125°C
Max Surge Current 4A
Current - Average Rectified (Io) 200mA DC
Forward Voltage 1V
Max Reverse Voltage (DC) 30V
Average Rectified Current 200mA
Reverse Recovery Time 5 ns
Peak Reverse Current 500nA
Max Repetitive Reverse Voltage (Vrrm) 30V
Capacitance @ Vr, F 7pF @ 1V 1MHz
Peak Non-Repetitive Surge Current 4A
Max Forward Surge Current (Ifsm) 4A
Recovery Time 5 ns
Outside Diameter 1.62 mm
Max Junction Temperature (Tj) 125°C
Height 1.7mm
Length 3.4mm
Width 1.62mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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