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NAND512R3A2AZB6E Tech Specifications

STMicroelectronics  NAND512R3A2AZB6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 55Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description TFBGA, BGA55,8X12,32
Access Time-Max 35 ns
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA55,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
Type SLC NAND TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 55
JESD-30 Code R-PBGA-B55
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.015 mA
Organization 64MX8
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.0001 A
Memory Density 536870912 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4K
Sector Size 16K
Page Size 512 words
Ready/Busy YES
Length 10 mm
Width 8 mm
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NAND512R3A2AZB6E Documents

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