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STMicroelectronics NAND02GW3B2DZA6F Memory Modules
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NAND02GW3B2DZA6F Tech Specifications
STMicroelectronics NAND02GW3B2DZA6F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 63Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | FBGA, BGA63,10X12,32 | |
| Access Time-Max | 20 ns | |
| Number of Words | 268435456 wordsWord | |
| Number of Words Code | 256000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PBGA-B63 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Supply Current-Max | 0.03 mA | |
| Organization | 256MX8 | |
| Memory Width | 8 | |
| Standby Current-Max | 0.00005 A | |
| Memory Density | 2147483648 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Data Polling | NO | |
| Toggle Bit | NO | |
| Command User Interface | YES | |
| Number of Sectors/Size | 2K | |
| Sector Size | 128K | |
| Page Size | 2K words | |
| Ready/Busy | YES |
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