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NAND02GR3B2DZA6E Tech Specifications

STMicroelectronics  NAND02GR3B2DZA6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 63Terminals
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x27
Row pitch 2.54mm
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Package Description FBGA, BGA63,10X12,32
Access Time-Max 20 ns
Number of Words 268435456 wordsWord
Number of Words Code 256000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 0.02 mA
Organization 256MX8
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 2147483648 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 128K
Page Size 2K words
Ready/Busy YES
Profile bronze
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NAND02GR3B2DZA6E Documents

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