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M58BW016BB80T3F Tech Specifications

STMicroelectronics  M58BW016BB80T3F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 80Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code QFP
Package Description PLASTIC, QFP-80
Access Time-Max 80 ns
Number of Words 524288 wordsWord
Number of Words Code 512000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP80,.7X.9,32
Package Shape RECTANGULAR
Package Style FLATPACK
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e0
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN LEAD
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Terminal Position QUAD
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code not_compliant
Pin Count 80
JESD-30 Code R-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.03 mA
Organization 512KX32
Seated Height-Max 3.4 mm
Memory Width 32
Standby Current-Max 0.000005 A
Memory Density 16777216 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 8,31
Sector Size 2K,16K
Boot Block BOTTOM
Common Flash Interface YES
Length 20 mm
Width 14 mm
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M58BW016BB80T3F Documents

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