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M29DW323DT70ZE6T Tech Specifications

STMicroelectronics  M29DW323DT70ZE6T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 48Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, TFBGA-48
Access Time-Max 70 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e0
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN LEAD
Additional Feature TOP BOOT BLOCK
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code not_compliant
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.02 mA
Organization 2MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.0001 A
Memory Density 33554432 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 8,63
Sector Size 8K,64K
Ready/Busy YES
Boot Block TOP
Common Flash Interface YES
Length 8 mm
Width 6 mm
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