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BGM123A256V2R Tech Specifications

Silicon Labs  BGM123A256V2R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 56-SMD Module
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56Terminations
Voltage - Supply 1.85V~3.8V
Terminal Position UNSPECIFIED
Terminal Form NO LEAD
Number of Functions 1Function
Supply Voltage 3.3V
Frequency 2.4GHz
JESD-30 Code S-XXMA-N56
Interface I2C, I2S, IrDA, SMBus, SPI, UART, USART
Memory Size 256kB Flash 32kB RAM
Nominal Supply Current 200mA
Data Rate 1Mbps
Protocol Bluetooth v4.2
Telecom IC Type TELECOM CIRCUIT
Power - Output 8dBm
RF Family/Standard Bluetooth
Antenna Type Integrated, Chip
Sensitivity -90dBm
Number of ADC Channels 1ADC Channel
Serial Interfaces I2C, I2S, SPI, UART
Current - Receiving 9mA
Current - Transmitting 8.2mA
Modulation GFSK
Number of GPIO 30GPIOs
Ambient Temperature Range High 85°C
Height 1.4mm
Length 6.5mm
RoHS Status Non-RoHS Compliant
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