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BGM111A256V2R Tech Specifications

Silicon Labs  BGM111A256V2R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case Module
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 31Terminations
HTS Code 8542.39.00.01
Voltage - Supply 1.85V~3.8V
Terminal Position UNSPECIFIED
Terminal Form NO LEAD
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 1.2mm
Frequency 2.4GHz
JESD-30 Code R-XXMA-N31
Interface I2C, SPI, UART
Memory Size 256kB Flash 32kB RAM
Nominal Supply Current 200mA
Data Rate 1Mbps
Utilized IC / Part EFR32BG
Protocol Bluetooth v4.2
Telecom IC Type TELECOM CIRCUIT
Power - Output 8dBm
RF Family/Standard Bluetooth
Antenna Type Integrated, Chip
Sensitivity -92dBm
Serial Interfaces I2C, SPI, UART
Current - Receiving 8.7mA
Current - Transmitting 8.2mA
Modulation GFSK
Number of GPIO 25GPIOs
Ambient Temperature Range High 85°C
Height 2.2mm
Length 15mm
Width 12.9mm
RoHS Status Non-RoHS Compliant
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