Sharp LRS1337 Memory ICs
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LRS1337 Tech Specifications
Sharp LRS1337 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 72Terminals | |
| Package Description | 8 X 11 MM, PLASTIC, FBGA-72 | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -25 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | LRS1337 | |
| Number of Words | 2097152 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Sharp Corp | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SHARP CORP | |
| Risk Rank | 5.92 | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Additional Feature | ALSO CONTAINS 262,144 X 16 SRAM | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PBGA-B72 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | 2MX16 | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 16 | |
| Memory Density | 33554432 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Width | 8 mm | |
| Length | 11 mm |
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