Semtech JANTX1N6643US Bridge Rectifiers Standard
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JANTX1N6643US Tech Specifications
Semtech JANTX1N6643US technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole | |
| Package / Case | Axial | |
| Surface Mount | YES | |
| Supplier Device Package | Axial | |
| Diode Element Material | SILICON | |
| Number of Terminals | 2Terminals | |
| EU RoHS | Supplier Unconfirmed | |
| ECCN (US) | EAR99 | |
| HTS | 8504.40.95.70 | |
| Automotive | No | |
| PPAP | No | |
| Maximum DC Reverse Voltage (V) | 75 | |
| Peak Reverse Repetitive Voltage (V) | 50 | |
| Maximum Continuous Forward Current (A) | 0.3@Ta=75C | |
| Peak Non-Repetitive Surge Current (A) | 2.5 | |
| Peak Forward Voltage (V) | 1.2@0.1A | |
| Peak Reverse Current (uA) | 0.5 | |
| Peak Reverse Recovery Time (ns) | 6 | |
| Minimum Operating Temperature (°C) | -65 | |
| Maximum Operating Temperature (°C) | 175 | |
| Supplier Temperature Grade | Military | |
| Mounting | Surface Mount | |
| Package Height | 2.16(Max) | |
| Package Width | 2.16(Max) | |
| Package Length | 4.95(Max) | |
| PCB changed | 2 | |
| Standard Package Name | MELF | |
| Supplier Package | MELF | |
| Package | Bulk | |
| Mfr | Semtech Corporation | |
| Product Status | Discontinued at Digi-Key | |
| Package Description | O-XELF-R2 | |
| Package Style | LONG FORM | |
| Package Body Material | UNSPECIFIED | |
| Operating Temperature-Min | -65 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 175 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | JANTX1N6643US | |
| Package Shape | ROUND | |
| Manufacturer | Microsemi Corporation | |
| Number of Elements | 1 Element | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Forward Voltage-Max (VF) | 1.2 V | |
| Risk Rank | 1.74 | |
| Series | * | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| Part Status | Active | |
| ECCN Code | EAR99 | |
| Type | Switching Diode | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Additional Feature | METALLURGICALLY BONDED | |
| HTS Code | 8541.10.00.70 | |
| Terminal Position | END | |
| Terminal Form | WRAP AROUND | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reach Compliance Code | compliant | |
| Pin Count | 2 | |
| Reference Standard | MIL-19500/578E | |
| JESD-30 Code | O-XELF-R2 | |
| Qualification Status | Qualified | |
| Configuration | Single | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Diode Type | Standard | |
| Current - Reverse Leakage @ Vr | 500 nA @ 50 V | |
| Voltage - Forward (Vf) (Max) @ If | 1.2 V @ 100 mA | |
| Case Connection | ISOLATED | |
| Operating Temperature - Junction | -65°C ~ 175°C | |
| Output Current-Max | 0.3 A | |
| Voltage - DC Reverse (Vr) (Max) | 50 V | |
| Current - Average Rectified (Io) | 300mA | |
| Rep Pk Reverse Voltage-Max | 50 V | |
| Capacitance @ Vr, F | - | |
| Non-rep Pk Forward Current-Max | 2.5 A | |
| Reverse Current-Max | 0.5 µA | |
| Reverse Recovery Time-Max | 0.006 µs | |
| Reverse Recovery Time (trr) | 6 ns |
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