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BFCN-2360 Tech Specifications

Seme LAB  BFCN-2360 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type SURFACE MOUNT
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
Package Description ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE FV1206, 4 PIN
Attenuation Frequency (+/- delta f)-Max 2110000 kHz
Operating Temperature-Min -55 °C
Operating Temperature-Max 100 °C
Rohs Code Yes
Manufacturer Part Number BFCN-2360+
Insertion Loss-Max 3 dB
Manufacturer Mini-Circuits
Part Life Cycle Code Active
Ihs Manufacturer MINI-CIRCUITS
Risk Rank 5.68
Attenuation Frequency (+/- delta f)-Min 510000 kHz
Series pushPIN™
Part Status Active
ECCN Code EAR99
Type Top Mount
Reach Compliance Code compliant
Physical Dimension L3.2XB1.6XH0.94 (mm)/L0.126XB0.063XH0.037 (inch)
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.590 (15.00mm)
Thermal Resistance @ Forced Air Flow 7.48°C/W @ 100 LFM
Filter Type CERAMIC BPF
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Center or Cutoff Frequency (fo/fc) 2360 MHz
Average Input Power 1.5 W
Input/Output Impedance 50 OHM
Width 1.575 (40.00mm)
Length 1.575 (40.00mm)
Diameter --
Height 0.94 mm
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