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PCIE-036-02-F-D-TH Tech Specifications

Samtec  PCIE-036-02-F-D-TH technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Nylon
Material - Insulation Polyamide (PA66), Nylon 6/6
Contact Materials Phosphor Bronze
Operating Temperature -55°C~125°C
Packaging Tube
Series PCI Express® (PCIe)
Published 2009
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
ECCN Code EAR99
Connector Type CARD EDGE CONNECTOR
Number of Positions 36Positions
Color Black
Number of Rows 2Rows
Gender Female
Additional Feature ROHS COMPLIANT
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.039 1.00mm
Total Number of Contacts 36Contacts
Orientation Straight
Depth 11mm
Current Rating 2.5A
Number of Conductors ONEConductor
Contact Finish Gold
Reliability COMMERCIAL
Number Of PCB Rows 4
Body Breadth 0.339 inch
UL Flammability Code 94V-0
Contact Style BELLOWED TYPE
Card Type PCI Express™
Read Out Dual
Body/Shell Style SOCKET
Contact Pattern RECTANGULAR
Mating Contact Row Spacing 0.04 inch
Features Board Guide
Length 25mm
Width 7.5mm
Contact Finish Thickness Flash
Card Thickness 0.062 1.57mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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PCIE-036-02-F-D-TH Documents

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