HTSW-117-08-L-D-RA Tech Specifications

Samtec  HTSW-117-08-L-D-RA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Contact Finish Mating Gold
Contact Length-Mating 0.230 5.84mm
Contact Materials Phosphor Bronze
Insulation Materials Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Series HTSW
Published 2005
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 34Positions
Number of Rows 2Rows
Gender Male
Fastening Type Push-Pull
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.240 6.10mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Number of Conductors ONEConductor
Reliability COMMERCIAL
Body Length or Diameter 1.7 inch
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.090 2.29mm
Shrouding Unshrouded
Number Of PCB Rows 2
Lead Pitch 2.54mm
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Mating Contact Pitch 0.1 inch
Contact Finish Thickness - Mating 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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