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HTSW-110-08-G-D-RA Tech Specifications

Samtec  HTSW-110-08-G-D-RA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Housing Material Polymer
Contact Finish Mating Gold
Contact Length-Mating 0.230 5.84mm
Contact Materials Phosphor Bronze
Insulation Materials Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Series HTSW
Published 2005
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 20Positions
Number of Rows 2Rows
Gender Male
Fastening Type Push-Pull
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) Varies by WireGAuge
Orientation Right Angle
Depth 12.44mm
Insulation Height 0.240 6.10mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Number of Conductors ONEConductor
Reference Standard UL
Reliability COMMERCIAL
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.090 2.29mm
Shrouding Unshrouded
Number Of PCB Rows 2
Lead Pitch 2.54mm
PCB Contact Pattern RECTANGULAR
Mating Information MULTIPLE MATING PARTS AVAILABLE
Body Breadth 0.198 inch
Housing Color Natural
Mating Contact Pitch 0.1 inch
Max Voltage Rating (AC) 450V
Max Current Rating 7.6A
Length 25.4mm
Plating Thickness 10μin
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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HTSW-110-08-G-D-RA Documents

Download datasheets and manufacturer documentation for   HTSW-110-08-G-D-RA

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