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HSEC8-112-01-L-DP-A-K Tech Specifications

Samtec  HSEC8-112-01-L-DP-A-K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mounting Type Surface Mount
Housing Material Liquid Crystal Polymer (LCP)
Material - Insulation Liquid Crystal Polymer (LCP)
RoHS Details
Mounting Styles Mounting Peg
Contact Materials Beryllium Copper
Maximum Operating Temperature + 125 C
Minimum Operating Temperature - 55 C
Factory Pack QuantityFactory Pack Quantity 250
Tradename Edge Rate
Package Tape & Reel (TR);Cut Tape (CT);
Base Product Number HSEC8-112
Mfr Samtec Inc.
Product Status Active
Series HSEC8
Packaging Reel
Operating Temperature -55°C ~ 125°C
Termination Solder
Number of Positions 24 PositionPosition
Color Black
Number of Rows 2 RowRow
Gender Female
Contact Type Cantilever
Pitch 0.8 mm
Contact Finish Gold
Card Type PCI Express™
Read Out Dual
Number of Positions/Bay/Row -
Flange Feature -
Product Sockets
Features Board Guide, Pick and Place
Contact Finish Thickness 10.0µin (0.25µm)
Card Thickness 0.063 (1.60mm)
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